Tape carrier package structure with reinforced outer leads

Filmträgerpackungsstruktur mit verstärkten Aussenanschlüssen

Structure d'empaquetage à support de bande à conducteurs externes renforcés

Abstract

A highly reliable assembly structure is provided by surely reducing a stress to be exerted on leads (12) of a TCP device (10). Part of a soldered portion of outer leads (12b) that is located closer to a semiconductor chip (11) of the TCP device (10) is reinforced by a support ring (14) formed on a side of the outer leads (12b) opposite from a circuit board (20), so that a stress to be exerted on the outer leads (12b) is dispersed to the leads (12), the support ring (14) and solder (31) to thereby prevent the possible occurrence of metal fatigue of the leads (12).

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Patent Citations (4)

    Publication numberPublication dateAssigneeTitle
    DE-4230330-A1March 11, 1993Hitachi LtdBandtraegerpackung und geraet fuer loetbondierung durch hochfrequenzerhitzung
    DE-4429004-A1June 14, 1995Siemens Nixdorf Inf SystTrägerspinne
    US-5107325-AApril 21, 1992Seiko Epson CorporationStructure and method of packaging a semiconductor device
    US-5478006-ADecember 26, 1995Sharp Kabushiki KaishaPrinted-circuit substrate and its connecting method

NO-Patent Citations (1)

    Title
    PROCEEDINGS OF THE INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLO SYMPOSIUM, BALTIMORE, SEPT. 28 - 30, 1992, no. SYMP. 13, 28 September 1992, INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, pages 343-347, XP000344575 NEWCOMBE III E H: "DESIGN TRADEOFFS WHEN USING SMT, COB, AND/OR TAB PACKAGING TECHNOLOGIES"

Cited By (0)

    Publication numberPublication dateAssigneeTitle